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On February 21-24, 1995, UCLA Extension will present the short course,
"Microelectromechanical Systems (MEMS): Technology, Design, and
Applications", on the UCLA campus in Los Angeles.
The instructors will be Prof. Kristofer S.J. Pister, Electrical Engineering,
UCLA, Prof. William Kaiser, Electrical Engineering, UCLA, Prof. Chang-Jin
"CJ" Kim, Mechanical, Aerospace, and Nuclear Engineering, UCLA, and Dr. Kurt
Petersen, Lucas NovaSensor.
For many years, microelectromechanical silicon sensors have made steady
progress in the commercial market, with medical sensor sales in the
millions, and automotive sensor sales in the tens of millions of parts per
year. With the maturity of the sensor technologies, and the recent
development of several new fabrication methods, MEMS research has enjoyed
explosive growth. This expansion is evident in the introduction of several
new journals dedicated to MEMS, more than a dozen regular MEMS conferences
worldwide, and a dramatic increase in government and industrial funding for
MEMS research in the U.S., Japan, and Europe.
This course offers the fundamentals of MEMS fabrication technology, sensor
and actuator component design, physical limits to sensor and actuator
performance, and system integration issues. The discussion of MEMS
fabrication technology covers bulk and surface micromachining of silicon (as
well as several other "unconventional" methods), with particular emphasis on
two commercially available processes. The design of MEMS is presented via
case study of several existing sensors and actuators, and participants are
given CIF files with examples of the structures analyzed. Advantages and
disadvantages of MEMS are explored by examining the fundamental physical
limits (e.g. noise performance) of these devices. System integration and
commercialization issues such as manufacturability, packaging, and
interfacing MEMS are illustrated by case study of existing products.
The course also includes:
o Simple MEMS cell libraries
o Material property and process test structures
o CMOS cells -- sensors, actuators, digital and analog electronics
o Surface micromachining cells: comb drives, flexures
o 3D hinged structures: several basic hinges, spring locked plates
o Space on a multi-project chip which will be fabricated after the
completion of the course, allowing each participant to create his/her own
MEMS structures.
For additional information and a complete course description, please contact
Marcus Hennessy at:
(310) 825-1047
(310) 206-2815 fax
mhenness@unex.ucla.edu
"Microelectromechanical Systems (MEMS): Technology, Design, and
Applications", on the UCLA campus in Los Angeles.
The instructors will be Prof. Kristofer S.J. Pister, Electrical Engineering,
UCLA, Prof. William Kaiser, Electrical Engineering, UCLA, Prof. Chang-Jin
"CJ" Kim, Mechanical, Aerospace, and Nuclear Engineering, UCLA, and Dr. Kurt
Petersen, Lucas NovaSensor.
For many years, microelectromechanical silicon sensors have made steady
progress in the commercial market, with medical sensor sales in the
millions, and automotive sensor sales in the tens of millions of parts per
year. With the maturity of the sensor technologies, and the recent
development of several new fabrication methods, MEMS research has enjoyed
explosive growth. This expansion is evident in the introduction of several
new journals dedicated to MEMS, more than a dozen regular MEMS conferences
worldwide, and a dramatic increase in government and industrial funding for
MEMS research in the U.S., Japan, and Europe.
This course offers the fundamentals of MEMS fabrication technology, sensor
and actuator component design, physical limits to sensor and actuator
performance, and system integration issues. The discussion of MEMS
fabrication technology covers bulk and surface micromachining of silicon (as
well as several other "unconventional" methods), with particular emphasis on
two commercially available processes. The design of MEMS is presented via
case study of several existing sensors and actuators, and participants are
given CIF files with examples of the structures analyzed. Advantages and
disadvantages of MEMS are explored by examining the fundamental physical
limits (e.g. noise performance) of these devices. System integration and
commercialization issues such as manufacturability, packaging, and
interfacing MEMS are illustrated by case study of existing products.
The course also includes:
o Simple MEMS cell libraries
o Material property and process test structures
o CMOS cells -- sensors, actuators, digital and analog electronics
o Surface micromachining cells: comb drives, flexures
o 3D hinged structures: several basic hinges, spring locked plates
o Space on a multi-project chip which will be fabricated after the
completion of the course, allowing each participant to create his/her own
MEMS structures.
For additional information and a complete course description, please contact
Marcus Hennessy at:
(310) 825-1047
(310) 206-2815 fax
mhenness@unex.ucla.edu