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The 3rd World Congress of Biomechanics

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  • The 3rd World Congress of Biomechanics


    is held in Sapporo, Japan, in August 1998, following the First and Second
    Congresses held in La Jolla, California, USA, in 1990 and in Amsterdam, The
    Netherlands, in 1994, respectively. Sapporo, which is located 1,000 km
    northeast from Tokyo, is known for its natural scenic beauty and
    comfortable weather in summer.

    The outline of The Third Congress is shown below. The first official
    anouncement including call for paper would be available by the end of this
    year. If you want to receive it, inform of your name, institution,
    address, phone number, fax number, and e-mail address to the Congress
    Office. If you have already sent us your information, you do not need to
    contact us because you are included in our mailing list.

    Congress Site: Hokkaido University, Sapporo, Japan
    Congress Date: August 2 - 8, 1998
    Congress Chairman: Kozaburo Hayashi, Osaka University
    Scientific Areas: Cardiovascular Biomechanics, Respiratory Biomechanics,
    Musculoskeletal Biomechanics, Joint Biomechanics, Spine Biomechanics, Head
    Biomechanics, Oro-maxillofacial Biomechanics, Sensory Organs Mechanics,
    Hard Tissue Biomechanics, Connective Tissue Biomechanics, Biofluid
    Dynamics, Biorheology, Biothermodynamics and Bioheat Conduction, Cellular
    and Molecullar Biomechanics, Tissue Engineering, Artificial Organs and
    Implants, Biomaterials and Medical Devices, Biomechanics and
    Rehabilitation, Physical Activities and Sports Biomechanics, Measurement
    and Analysis for Biomechanics, Computational Biomechanics, Modeling and
    Simulation for Biomechanics, Animal Biomechanics, etc.
    Special Programs: Plenary Lectures, Keynote Lectures, Symposia, Reception,
    Excursion, Banquet at Sapporo Brewery
    Congress Office: Biomechanics Laboratory, Department of Mechanical
    Engineering, Faculty of Engineering Science, Osaka University, Toyonaka,
    Osaka 560, Japan; Phone, +81-6-850-6170; Fax, +81-6-850-6171; E-mail,