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On May 19-22, 1997, UCLA Extension will present the short course,
"Microelectromechanical Systems (MEMS): Technology, Design, and
Applications", on the UCLA campus in Los Angeles.
The instructors are Abraham Lee, PhD, Lawrence Livermore National
Laboratory (LLNL); Prof. Chang-Jin "CJ" Kim, Mechanical and Aerospace
Engineering, UCLA; Peter Krulevitch, PhD, LLNL; M. Allen Northrup, PhD,
LLNL; and William C. Tang, PhD, Jet Propulsion Laboratory.
For many years, microelectromechanical silicon sensors have made
steady progress in the commercial market, with medical sensor sales in
the millions, and automotive sensor sales in the tens of millions of
parts per
year. With the maturity of the sensor technologies, and the recent
development of several new fabrication methods, MEMS research has
enjoyed explosive growth. This expansion is evident in the introduction
of
several new journals dedicated to MEMS, more than a dozen regular
MEMS conferences worldwide, and a dramatic increase in government
and industrial funding for MEMS research in the U.S., Japan, and Europe.
This course offers the fundamentals of MEMS fabrication technology,
sensor and actuator component design, physical limits to sensor and
actuator performance, and system integration issues. The discussion of
MEMS fabrication technology covers bulk and surface micromachining of
silicon (as well as several other "unconventional" methods), with
particular
emphasis on two commercially available processes. The design of MEMS
is presented via case study of several existing sensors. Advantages and
disadvantages of MEMS are explored by examining the fundamental
physical limits of these devices. System integration and
commercialization
issues such as manufacturability, packaging, and interfacing MEMS are
illustrated by case study of existing products.
The course also includes:
o Material property and process test structures
o Surface micromachining cells: comb drives, flexures
o Introduction to the design rules
o Process of commercially available multi-project chip
o Design of MEMS
The course fee is $1295, which includes extensive course materials.
These materials are for participants only, and are not for sale.
For additional information and a complete course description, please
contact Marcus Hennessy at:
(310) 825-1047
(310) 206-2815 fax
mhenness@unex.ucla.edu
http://www.unex.ucla.edu/shortcourses
This course may also be presented on-site at company locations.
"Microelectromechanical Systems (MEMS): Technology, Design, and
Applications", on the UCLA campus in Los Angeles.
The instructors are Abraham Lee, PhD, Lawrence Livermore National
Laboratory (LLNL); Prof. Chang-Jin "CJ" Kim, Mechanical and Aerospace
Engineering, UCLA; Peter Krulevitch, PhD, LLNL; M. Allen Northrup, PhD,
LLNL; and William C. Tang, PhD, Jet Propulsion Laboratory.
For many years, microelectromechanical silicon sensors have made
steady progress in the commercial market, with medical sensor sales in
the millions, and automotive sensor sales in the tens of millions of
parts per
year. With the maturity of the sensor technologies, and the recent
development of several new fabrication methods, MEMS research has
enjoyed explosive growth. This expansion is evident in the introduction
of
several new journals dedicated to MEMS, more than a dozen regular
MEMS conferences worldwide, and a dramatic increase in government
and industrial funding for MEMS research in the U.S., Japan, and Europe.
This course offers the fundamentals of MEMS fabrication technology,
sensor and actuator component design, physical limits to sensor and
actuator performance, and system integration issues. The discussion of
MEMS fabrication technology covers bulk and surface micromachining of
silicon (as well as several other "unconventional" methods), with
particular
emphasis on two commercially available processes. The design of MEMS
is presented via case study of several existing sensors. Advantages and
disadvantages of MEMS are explored by examining the fundamental
physical limits of these devices. System integration and
commercialization
issues such as manufacturability, packaging, and interfacing MEMS are
illustrated by case study of existing products.
The course also includes:
o Material property and process test structures
o Surface micromachining cells: comb drives, flexures
o Introduction to the design rules
o Process of commercially available multi-project chip
o Design of MEMS
The course fee is $1295, which includes extensive course materials.
These materials are for participants only, and are not for sale.
For additional information and a complete course description, please
contact Marcus Hennessy at:
(310) 825-1047
(310) 206-2815 fax
mhenness@unex.ucla.edu
http://www.unex.ucla.edu/shortcourses
This course may also be presented on-site at company locations.