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  • STRAIN MEASUREMENT IN BIOMECHANICS


    Int. Conf. TECHNOLOGY TRANSFER between HIGH TECH ENG. and BIOMECHANICS

    UNIVERSITY OF LIMERICK, IRELAND

    4TH AND 5TH SEPTEMBER 1992


    A sample of the programme follows:

    1) The Interaction of Experimental and Numerical Techniques in Modern
    Stress Analysis
    Dr. T. Hellen (Nuclear Electric, U.K.)

    2) Study of the Pin-Bone Interface in Fracture Fixation
    J.B.Finlay et al. (U. of Western Ontario, Canada)

    3) Technology Transfer Regarding the Measurement of Strain on
    Flexible Materials with Special Ref. to Soft Tissue
    N.E.Shrive, E.Damson and C.B.Frank (U. of Calgary, Canada)

    4) The Thermoelastic Response of Anisotropic Composites
    Prof. P. Stanley (U. of Manchester, U.K.)

    5) Residual Stresses: Their Measurement and Significance
    G.M.Smith and C.B.Jolly (NEI Parsons, U.K.)

    6) Application of the Rupture Mechanics Method 'The Chip Test' to the
    Adhesion Evaluation of Orthodontic Brackets
    E.Serfaty and M. Barquins (Ecole Superieure de Physique et de Chimie,
    France)

    7) The Force Meassurementesign and Construction Criteria for New
    Force Standard Machines
    Prof. A. Bray (Istituto di Metrologia, Italy)

    8) A Telemetry System for In Vivo Strain Measurement in Orthopaedic
    Endoprostheses
    S.J.Taylor, N. de N. Donaldson, J. Meswanis and J.Perry

    (Inst. of Orthopaedics, U. of London, U.K.)

    9) Some Coherent-Optical Deformation Measurement Techniques Useful in
    Biomechanics
    Dr.P.M.Boone (SOETE-RUG, Belgium)

    10) The Use of Holographic Interferometry in the Assessment of Orthop.
    Implants.
    A. Spirakis et al. (U. of Cape Town, S. Africa)


    11) The Annual BSSM Strain Measurement Lecture:
    The Lack of Tech. Transfer Within Low Tech Eng. Disciplines: How it
    has Affected Experimental Stress Analysis History.
    P.K.Stein (Stein Eng. Services, U.S.A.)


    This conference has been organised by the BSSM Bioengineering Measurements
    Technical who have also held meetings in the U.K., Canada and Italy.

    The meeting is co-sponsored by SEM.

    Proc. are being publlished by Elsevier.


    For further information contact*

    The conf. Secretariat,
    Prof. E.G. Little,
    Dept. of Mech. Eng.,
    University of Limerick,
    Ireland.

    FAX:+353-61-333644
    email: Littlet@ul.ie
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