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Wake Forest Biomedical Engineering and Informatics Summer Research Experience Internship Program
The Department of Biomedical Engineering and Center for Biomedical Informatics at Wake Forest University School of Medicine invite current undergraduate students and master’s level graduate students to apply for our Biomedical Engineering and Informatics Summer Research Experience Internship Program. Students admitted into the program will receive a $5,500 stipend and on-campus housing for the duration of the 10-week summer program.
PROGRAM DETAILS:
https://tinyurl.com/BME-REU-WFU
APPLICATION DEADLINE: JAN. 25, 2023
https://redcap.link/REU2023
Our 10-week internship program from May 29 – August 4, 2023 offers research opportunities focused on Imaging and Mechanics-based Projects on Accidental Cases of Trauma (IMPACT) and Culturally Augmented Learning In Biomedical Informatics Research (CALIBIR), and many other topics, including:
Underrepresented minorities and students from colleges with limited research opportunities in science, technology, engineering, and mathematics are highly encouraged to apply.
PROGRAM DETAILS:
https://tinyurl.com/BME-REU-WFU
APPLICATION DEADLINE: JAN. 25, 2023
https://redcap.link/REU2023
Our 10-week internship program from May 29 – August 4, 2023 offers research opportunities focused on Imaging and Mechanics-based Projects on Accidental Cases of Trauma (IMPACT) and Culturally Augmented Learning In Biomedical Informatics Research (CALIBIR), and many other topics, including:
- Injury prediction modeling
- Finite element modeling applied to trauma
- Military, sports, and spaceflight safety
- Osteoporosis prevention
- Biomechanical injury mechanisms
- Diagnostics and therapies for cancer patients
- Medical device testing and prototyping
- Biomedical informatics and data science
- Imaging and artificial intelligence
- Development and use of machine learning based algorithms
- Academic Learning Health Care Systems
Underrepresented minorities and students from colleges with limited research opportunities in science, technology, engineering, and mathematics are highly encouraged to apply.